On October 20, 2021, Shenzhen Hongfuhan Technology Co., Ltd. (stock code: 301086) reached an important milestone in its development process - officially listed on the ChiNext board of the Shenzhen Stock Exchange. This milestone event marks a new chapter in the company's development.

Hongfuhan is mainly engaged in the design, research and development, production, and sales of heat dissipation and other functional devices and automation equipment. The company's heat dissipation and other functional device products are widely used in consumer electronics products and components such as smartphones, tablets, laptops, smart wearables, and home smart devices; At the same time, the company provides customers with automated equipment and auxiliary tools such as fixtures, carriers, and cutting tools, mainly used for downstream customers' end product production processes such as bonding, assembly, laser cutting, precision machining, and testing.

The company has high-quality customer resources, with direct customers mainly being manufacturing service providers and component manufacturers in the consumer electronics industry chain, including Foxconn Group, Pengding Holdings, OFILM, Murata Company, Amphenol Group, BOE, Lite On Group, Zhengwei Group, etc.

This successful listing is not only a witness to the steady development of Hongfuhan in the past, but also the starting point of a new journey in the future.

Looking ahead to the future, Hongfuhan will continue to uphold the core values of "humanity, technology, and learning", always adhere to market oriented, technology supported, and honest and trustworthy as the fundamental principles, continuously improve its technical strength, provide customers with optimized die-cutting products and overall solutions for automation equipment, and strive to become a first-class domestic and internationally renowned supplier.